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Qualcomm’s Binned Snapdragon 8 Elite Chip: Optimized for Foldables

qualcomm's binned snapdragon 8 elite chip optimized for foldables qualcomm's binned snapdragon 8 elite chip optimized for foldables

Poised to be the phone chip of choice for the best Android phones and foldables of 2024, Qualcomm’s Snapdragon 8 Elite chipset is blowing minds. A unique version of this high-performance chip will be included in foldable devices designed to overcome hardware limitations specific to these devices.

A Tailored Snapdragon 8 Elite for Foldables

The Snapdragon 8 Elite, in its standard form, boasts a powerful 8-core CPU configuration:

  • Two Prime Oryon cores ran at 4.32GHz.
  • Six Performance cores running at 3.53GHz.

A variant of the same chip, SM8750-3-AB, has been spotted for foldable devices. The CPU cluster 7-core version with one less Performance core.

Why is the Adjustment?

qualcomm's binned snapdragon 8 elite chip optimized for foldables

Qualcomm has not given any official information on this 7-core variant, a footnote in Snapdragon 8 Elite’s technical documentation has confirmed its existence. The rationale behind this design tweak lies in the unique challenges posed by foldable devices:

  • Thermal Management: Due to their compact form factors, clamshell models like the Galaxy Z Flip 6 or Moto Razr+ do not have much room to put in any cooling hardware.
  • Power Efficiency: By reducing a Performance core, foldable devices’ thermal and battery life limits can be addressed with low.
  • Minimal Performance Impact: With a reduced core count, the 7-core Snapdragon 8 Elite provides similar real-world performance, delivering balance and smooth multitasking app responsiveness.

Potential Foldables Using the Binned Chip

The binned Snapdragon 8 Elite variant is expected to power several upcoming foldable, including:

  • Samsung Galaxy Z Fold 7
  • OnePlus Open 2 / Oppo Find N5
  • Galaxy Z Flip 6
  • Moto Razr+

However, recent leaks indicate that Oppo Find N5 will indeed pack the 7-core version of the Snapdragon 8 Elite.

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A First for Qualcomm

It represents Qualcomm’s first offering of a binned version of its flagship SoC targeting foldable. It is the first time a lower core count chip has been designed for a particular category of devices; the company has previously created higher binned, overclocked versions of the chips for Samsung’s “Galaxy” branding.

The Manufacturer’s Choice

Depending on the device design and thermal requirements, manufacturers can choose between the standard 8-core variant or a binned 7-core version.

What This Means for Foldables

Qualcomm’s move heralds a trend of recognizing the specific hardware problems foldables pose. The company also secures a tailored chipset whereby foldable devices can provide flagship-grade performance without compromising useability, heat management, and battery life.

This innovation means a smoother, faster, more reliable experience for consumers, especially on tasks that require lots of power, such as video editors, gaming, and multitasking.

Looking Ahead

Qualcomm’s decision to create a bespoke Snapdragon 8 Elite chipset for its upcoming flagship foldables indicates that these devices will prove exciting. It is a worthwhile niche to embrace if competitors do the same. It optimized the chip to set the new standard for foldable performance in 2024, with the OnePlus Open 2 and Galaxy Z Fold 7 on the horizon.

These devices will be released as they hit the market and show what Qualcomm-powered foldables can do in the next generation.

ethan cole author
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